Effect of SiC Whiskers on the Microstructure and Thermal Conductivity of Carbon Foam

  • Sheng Jie Yu, Zhao Feng Chen, Yang Wang
  • Materials Science Forum, March 2018, Trans Tech Publications
  • DOI: 10.4028/www.scientific.net/msf.917.106

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http://dx.doi.org/10.4028/www.scientific.net/msf.917.106