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Many electronic components are made as multilayer chips or surface mounted devices, such as multilayer chip inductors (MLCIs), many of which contain soft ferrites, and which often require hexaferrites for high frequency applications. Such materials are made of layers of low-temperature co-fired ceramics (LTCCs), where the various ceramics layers (thick or thin films) such as magnetic and dielectric ceramics are co-fired with layers of metal paste or printed metal electrodes in a single chip. For reasons of its high conductivity, lower cost, and lower electrical loses. For this reason, there are many investigation into the use of sintering aids, additives that lower the sintering temperature of hexaferrites, ideally to below 960 °C

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This page is a summary of: Influence of Addition of CaO and SiO2 in Microstructure of Hexaferrite BaXSr1-XFe12O19, Materials Science Forum, January 2018, Trans Tech Publications,
DOI: 10.4028/www.scientific.net/msf.912.21.
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