A Study on Damage Behavior and Strength of Smart Material under Low Temperature Using Acoustic Emission

Jin Kyung Lee, Young Chul Park, Sang Pill Lee, Joon Hyun Lee, Jong Baek Lee
  • Key Engineering Materials, January 2006, Trans Tech Publications
  • DOI: 10.4028/www.scientific.net/kem.321-323.174

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http://dx.doi.org/10.4028/www.scientific.net/kem.321-323.174