Numerical Analysis of Slurry Flow and Contact Pressure in CMP Considering the Effects of Retaining Ring

  • Chao Li, Ping Zhou, Zhu Ji Jin, Bi Zhang, Shuang Ji Shi
  • Advanced Materials Research, January 2016, Trans Tech Publications
  • DOI: 10.4028/www.scientific.net/amr.1136.338

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http://dx.doi.org/10.4028/www.scientific.net/amr.1136.338