Publication not explained
This publication has not yet been explained in plain language by the author(s). However, you can still read the publication.
If you are one of the authors, claim this publication so you can create a plain language summary to help more people find, understand and use it.
Featured Image
Read the Original
This page is a summary of: Work Envelope Expansion and Parametric Optimization in WAAM with Relative Density and Surface Aspect as Quality Constraints: The Case of Al5Mg Thin Walls with Active Cooling, Journal of Manufacturing and Materials Processing, April 2021, MDPI AG,
DOI: 10.3390/jmmp5020040.
You can read the full text:
Contributors
The following have contributed to this page
