Publication not explained
This publication has not yet been explained in plain language by the author(s). However, you can still read the publication.
If you are one of the authors, claim this publication so you can create a plain language summary to help more people find, understand and use it.
Read the Original
This page is a summary of: Material-related fundamentals of cutting techniques for GaAs wafer manufacturing, Zeitschrift für Metallkunde, July 2005, De Gruyter, DOI: 10.3139/146.101103.
You can read the full text:
The following have contributed to this page