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The primary use of analytical solutions in the area of thermal conduction problems is for verification purposes, comparing the calculated temperatures and heat flux values to the results from numerical codes. In this current study, four solutions are offered in a geometry involving a hollow cylinder.

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This page is a summary of: Analytical Solution for One-Dimensional Transient Thermal Conduction in a Hollow Cylinder, Journal of Thermophysics and Heat Transfer, January 2024, American Institute of Aeronautics and Astronautics (AIAA),
DOI: 10.2514/1.t6844.
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