What is it about?

The need for high-heat flux cooling is becoming increasingly critical across a range of sectors including micro-electronics. One approach is flash boiling, but in turn, one needs an appropriate model of the physics of this process in order to control the process and meet real performance specs. We present such a model and validate it using experimental data.

Featured Image

Read the Original

This page is a summary of: Control-Oriented Modeling of Integrated Flash Boiling for Rapid Transient Heat Dissipation, Journal of Thermophysics and Heat Transfer, July 2019, American Institute of Aeronautics and Astronautics (AIAA),
DOI: 10.2514/1.t5604.
You can read the full text:

Read

Contributors

Be the first to contribute to this page