What is it about?
With the systematic measurement and analysis described in this paper, we can further identify the related EMI problem and resolve the severe chip or module level EMC problem more effectively.
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Why is it important?
As the wireless applications for high-performance computing and video streaming is booming, the converging high performance devices for wireless and mobile application bring up the platform noise and RFI de-sensitivity issue. The problem involving with electromagnetic compatibility (EMC) or radio frequency interference (RFI) is becoming more critical for the system integration and design.
Perspectives
From chip-level EMI characteristics and components placement to predict RFI problem and optimal design techniques.
HAN-NIEN LIN
Feng Chia University
Read the Original
This page is a summary of: Characteristic Analysis and Applications of Electromagnetic Shielding Materials for Wireless Communications Device, The Open Materials Science Journal, July 2016, Bentham Science Publishers,
DOI: 10.2174/1874088x01610010044.
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