What is it about?
The main objective of this project is to design and implement 8-Bit low power and high speed adder structures using different logic styles in 90nm CMOS and 32nm FinFET processes. The various logic styles used for the implementation of 8-bit adders are Complementary Metal-Oxide Semiconductor (CMOS), Complementary Pass-Transistor Logic (CPL), Transmission Gate (TG) and Gate Diffusion Input (GDI). The proposed work will aim to minimise the Dynamic Power and leakage power. The key performance metrics like dynamic power, static power, leakage power, delay, power delay product will be measured for all adder circuits implemented using various logic styles and they will be compared.
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Why is it important?
The leakage power becomes a predominant power dissipation due to the scaling of the feature size to sub nanometer level. As the device feature size is scaled down, the threshold voltages are also scaled down to a minimum level which exponentially increases the leakage during the stand-by mode especially when all nMOS devices are in cut-off state. Hence it is mandatory to minimise the leakage power during the cut-off state of the transistors. FinFET transistors are used to minimise the leakage power since the multi-gate structure of the FinFET minimises the leakage power during cut-off state. Our results prove that, FinFET not only has exceptional performance over MOSFET but is prepped to take over MOSFET as the superior technology below 90nm.
Perspectives
I hope this research work enhances the use of FinFET technology for designing the circuits in the future. I believe that the presented results will promote further research work on GDI technique.
Aalelai Vendhan
Birla Institute of Technology and Science
Read the Original
This page is a summary of: Investigations on performance metrics of FINFET based 8- bit low power adder architectures implemented using various logic styles http://www.indjst.org/index.php/indjst/article/view/111071 1489988072, Indian Journal of Science and Technology, June 2018, Indian Society for Education and Environment,
DOI: 10.17485/ijst/2018/v11i24/111071.
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