What is it about?
Electroless deposition of nickel was performed in a foam of electrolyte in place of electroplating liquid. This method enabled to reduce the number of pinholes in the film, which is a persistent problem in the plating technology.
Featured Image
Why is it important?
Both electro- and electroless deposition cannot avoid generation of hydrogen bubbles on the plating surface owing to electrolysis of water. The hydrogen bubbles cause pinholes in the film, crucially deteriorating the corrosion resistance. We found that the foam can remove the hydrogen bubbles efficiently from the surface.
Perspectives
Read the Original
This page is a summary of: Characteristics of nickel thin films prepared by electroless plating in foam of electrolyte, MRS Communications, November 2017, Cambridge University Press,
DOI: 10.1557/mrc.2017.124.
You can read the full text:
Resources
Contributors
The following have contributed to this page