What is it about?
Electroless deposition of nickel was performed in a foam of electrolyte in place of electroplating liquid. This method enabled to reduce the number of pinholes in the film, which is a persistent problem in the plating technology.
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Why is it important?
Both electro- and electroless deposition cannot avoid generation of hydrogen bubbles on the plating surface owing to electrolysis of water. The hydrogen bubbles cause pinholes in the film, crucially deteriorating the corrosion resistance. We found that the foam can remove the hydrogen bubbles efficiently from the surface.
Perspectives
Although the film growth rate is smaller the foam than in the conventional liquid, the pinhole-free deposition technique enables to reduce the film thickness and has profound impact for the practical applications that requires corrosion resistance. In addition, we can reduce the net amount of plating solution by replacing the liquid with foam.
Hiroaki USUI
Tokyo University of Agriculture and Technology
Read the Original
This page is a summary of: Characteristics of nickel thin films prepared by electroless plating in foam of electrolyte, MRS Communications, November 2017, Cambridge University Press,
DOI: 10.1557/mrc.2017.124.
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