Stress evolution in a Ti/Al(Si,Cu) dual layer during annealing

  • Ola Bostrom, Patrice Gergaud, Olivier Thomas, Philippe Boivin
  • MRS Proceedings, January 2001, Cambridge University Press
  • DOI: 10.1557/proc-673-p1.5

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http://dx.doi.org/10.1557/proc-673-p1.5