Electromigration Characteristics of Cu and Al Interconnections

  • S. Shingubara, K. Fujiki, A. Sano, H. Sakaue, Y. Horiike
  • MRS Proceedings, January 1994, Cambridge University Press
  • DOI: 10.1557/proc-338-441

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http://dx.doi.org/10.1557/proc-338-441