What is it about?
Novel-developed Sn–Ag–Zn Solders are regarded as high-temperature solder alloys. These alloys exhibited better wettability compared to other solder alloys. These alloys emulate the wetting properties of Sn-Pb alloys. Indicating that toxic Pb base solder alloys can be replaced.
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Why is it important?
Proposed novel Sn-2.625Ag-2.25Zn and Sn-1.75Ag-4.5Zn solder alloys are unique in terms of wetting properties and melting temperature, especially on copper substrates. Sn-2.625Ag-2.25Zn solder exhibited a thin continuous interface on disk polished and a thick interface on SiC polished Cu substrates. Belt polished Cu substrates exhibited a coarser interface with needle-shaped IMCs growing into the solder field. On disk polished Cu substrates, Sn-1.75Ag-4.5Zn solder exhibited a thin interface. A thick interface with nodular IMC in the solder matrix is observed in SiC polished Cu substrate. Theses nodular IMCs were tra
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The journal is one of the best journals. I am glad to publish with my guru (guide) and mentor. Citations for the journal are in an exponential form. Still expecting more citations in Google scholar.
Dr Satyanarayan .
Alva’s Institute of Engineering and Technology
Read the Original
This page is a summary of: Wetting Behaviour and Evolution of Microstructure of Sn–Ag–Zn Solders on Copper Substrates with Different Surface Textures, Journal of ASTM International, January 2010, ASTM International,
DOI: 10.1520/jai103052.
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