Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules

  • S.S. Kim, I. Son, K.T. Kim
  • Archives of Metallurgy and Materials, January 2017, De Gruyter
  • DOI: 10.1515/amm-2017-0182

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http://dx.doi.org/10.1515/amm-2017-0182