Publication not explained
This publication has not yet been explained in plain language by the author(s). However, you can still read the publication.
If you are one of the authors, claim this publication so you can create a plain langauage summary to help more people find, understand and use it.
Read the Original
This page is a summary of: Development and application of MIPAR™: a novel software package for two- and three-dimensional microstructural characterization, Integrating Materials and Manufacturing Innovation, April 2014, Springer Science + Business Media, DOI: 10.1186/2193-9772-3-10.
You can read the full text:
Be the first to contribute to this page