Development and application of MIPAR™: a novel software package for two- and three-dimensional microstructural characterization

  • John M Sosa, Daniel E Huber, Brian Welk, Hamish L Fraser
  • Integrating Materials and Manufacturing Innovation, April 2014, Springer Science + Business Media
  • DOI: 10.1186/2193-9772-3-10

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http://dx.doi.org/10.1186/2193-9772-3-10