What is it about?
The paper explains the interfacial structure between aluminum wires and aluminum alloy pads connected by ultrasonic bonding technique. The bond-area expansion behavior and the surface oxide removal are discussed.
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Why is it important?
The paper explains the fundamental phenomena and of ultrasonic bonding and resultant microstructures.
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This page is a summary of: Interfacial microstructure between thick aluminium wires and aluminium alloy pads formed by ultrasonic bonding, Science and Technology of Welding & Joining, February 2013, Taylor & Francis,
DOI: 10.1179/1362171812y.0000000088.
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