A critical review of constitutive models for solders in electronic packaging

  • Gang Chen, Xiaochen Zhao, Hao Wu
  • Advances in Mechanical Engineering, August 2017, SAGE Publications
  • DOI: 10.1177/1687814017714976

The authors haven't yet claimed this publication.

Read Publication

http://dx.doi.org/10.1177/1687814017714976