Thermal Interface Conductance Between Aluminum and Silicon by Molecular Dynamics Simulations

  • Nuo Yang, Tengfei Luo, Keivan Esfarjani, Asegun Henry, Zhiting Tian, Junichiro Shiomi, Yann Chalopin, Baowen Li, Gang Chen
  • Journal of Computational and Theoretical Nanoscience, February 2015, American Scientific Publishers
  • DOI: 10.1166/jctn.2015.3710

The authors haven't yet claimed this publication.

Read Publication

http://dx.doi.org/10.1166/jctn.2015.3710