Seedless Copper Electrochemical Deposition on PVD Resistive Substrates as a Replacement/Enhancement for PVD Cu Seed Layers in HAR TSVs

  • Silvia Armini, Chris J. Wilson, Alain Moussa, Alexis Franquet, Kris Vanstreels, Tanya Atanasova, Alex Radisic, Yann Civale, Annemie Van Ammel, Zaid El-Mekki, George Bryce, Wouter Ruythooren
  • ECS Transactions, December 2019, The Electrochemical Society
  • DOI: 10.1149/1.3502446

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