Low-Temperature Silicon Wafer-Scale Thermocompression Bonding Using Electroplated Gold Layers in Hermetic Packaging

  • Gil-Soo Park, Yong-Kook Kim, Kyeong-Kap Paek, Jin-Sang Kim, Jong-Heun Lee, Byeong-Kwon Ju
  • Electrochemical and Solid-State Letters, January 2005, The Electrochemical Society
  • DOI: 10.1149/1.2077077

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http://dx.doi.org/10.1149/1.2077077

The following have contributed to this page: Jong-Heun Lee