What is it about?
This is a comparative analysis of NFIC and TSV based NoCs and the design choices that need to made in order to properly design high performance and reliable NoC using either of the link types.
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Why is it important?
This work takes into consideration the physical characteristics of physical links while designing the 3D NoC, which has been often neglected in NoC research.
Perspectives
As my first foray into NoC design and physical characteristic analysis of links and communication methods, I understood where the industry needs to move to design truly high-performance 3D ICs.
Aqeeb Iqbal Arka
Washington State University
Read the Original
This page is a summary of: Making a Case for Partially Connected 3D NoC, ACM Journal on Emerging Technologies in Computing Systems, October 2020, ACM (Association for Computing Machinery),
DOI: 10.1145/3394919.
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