Application of three dimensional electromechanical impedance model for damage assessment of plate

Venu Gopal Madhav Annamdas, Yaowen Yang, Seunghee Park
  • April 2012, SPIE
  • DOI: 10.1117/12.920962

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http://dx.doi.org/10.1117/12.920962

The following have contributed to this page: Yaowen Yang and Dr Venu Gopal Madhav Annamdas