Optimized Focused Ion Beam Inspection And Repair Of Wafer Scale Interconnections

J. F. McDonald, R. U. Rajapakse, H. T. Lin, R. Selvaraj, J. C. Corelli, H. S. Jin, S. Balakrishnan, A. J. Steckl
  • June 1987, SPIE
  • DOI: 10.1117/12.940373

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http://dx.doi.org/10.1117/12.940373