Characterization of low-temperature wafer bonding by infrared spectroscopy

A. Milekhin, M. Friedrich, K. Hiller, M. Wiemer, T. Gessner, D. R. T. Zahn
  • Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena, January 2000, American Vacuum Society
  • DOI: 10.1116/1.591391

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http://dx.doi.org/10.1116/1.591391

The following have contributed to this page: Professor Dietrich RT Zahn