Damage Accumulation During Stress Relaxation of Polymer Films in Bending

D. Ingman, Y. Michlin
  • Journal of Electronic Packaging, January 2002, ASME International
  • DOI: 10.1115/1.1463731

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http://dx.doi.org/10.1115/1.1463731

The following have contributed to this page: Yefim Michlin