Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

  • Valentin Bissuel, Michel Brizoux, Arnaud Grivon, Eric Monier-Vinard, Fabrice Pires
  • Journal of Electronic Packaging, January 2011, ASME International
  • DOI: 10.1115/1.4004830

Analytical thermal modeling of PCBs

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http://dx.doi.org/10.1115/1.4004830

The following have contributed to this page: Eric Monier-Vinard