What is it about?
Given the common manufacturing challenges to meet the copper wrap specifications in IPC 6012, we performed a suite of tests and subsequent analyses to demonstrate that the copper wrap requirements for blind and buried vias do not provide any assurance or improvement in reliability vs not meeting said requirements.
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Why is it important?
Not only can it be costly to meet these particular manufacturing requirements, efforts to do so might ultimately reduce the reliability of the pertinent printed circuit boards.
Perspectives
This paper provided our results and lessons from the series of tests we performed as a result of major "self-created" problems in board development for NASA space missions.
Dr. Jesse Adam Leitner
NASA
Read the Original
This page is a summary of: A Study on Effects of Copper Wrap Specifications on Printed Circuit Board Reliability, IEEE Transactions on Reliability, January 2018, Institute of Electrical & Electronics Engineers (IEEE),
DOI: 10.1109/tr.2018.2835140.
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