Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

Vadimas Verdingovas, Morten Stendahl Jellesen, Rajan Ambat
  • IEEE Transactions on Device and Materials Reliability, March 2014, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/tdmr.2013.2293792

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http://dx.doi.org/10.1109/tdmr.2013.2293792

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