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In this article, the input and output impedances of the bondwire interconnects in quad at no-lead (QFN) packages are extracted and analyzed over the wide frequency range of dc–100 GHz. It is shown that knowing the impedance parameters of a transition makes it simpler and faster to optimize the structure for a desired operating frequency. Using extracted impedance properties, a compensation bondwire interconnections method based on only one quarter-wavelength impedance transformer line on the printed circuit board (PCB) side is proposed.
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This page is a summary of: Characterization and Performance Improvement of Bondwire Interconnects in QFN Packages for Bandpass mm-Wave Applications, IEEE Transactions on Components Packaging and Manufacturing Technology, January 2024, Institute of Electrical & Electronics Engineers (IEEE),
DOI: 10.1109/tcpmt.2024.3352183.
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