Hydrophilization treatment of copper surface usingan atmospheric damage-free plasma source

Shotaro Yamasaki, Ryota Sasaki, Hidekazu Miyahara, Eiki Hotta, Akitoshi Okino, Ryuichi Shimada
  • June 2009, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/plasma.2009.5227472

The authors haven't finished explaining this publication. If you are the author, sign in to claim or explain your work.

Read Publication

http://dx.doi.org/10.1109/plasma.2009.5227472

The following have contributed to this page: Professor Akitoshi Okino