Characterization of on-wafer RF passive components for RFIC devices using three-steps de-embedding method

Maisurah M.H. Siti, Nizam O. Mohd, A. Marzuki, A.I. Abdul Rahim, Razman Y Mohamed
  • December 2009, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/micc.2009.5431531

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http://dx.doi.org/10.1109/micc.2009.5431531

The following have contributed to this page: Dr Arjuna Bin Marzuki