What is it about?
A planar microstrip array antenna of 42 patches is developed to be used for 5G base station communication at 28GHz. The antenna was configured in two layers with the patches stacked on each other for parasitic feeding. A novel elliptical stripline feeding method is also implemented with adaptive via hole arrangement to feed the 6 x 7 array. Superior side-lobe levels of better than -19.4dB is achieved with gains of more than 21.4dBi in both azimuth and elevation planes. VSWR less than 1.96dB is achieved for a 1GHz bandwidth.
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Why is it important?
This research designed a planar low profile microstrip array antenna for the next generation millimeter-wave communication. A 6-way stripline power divider is designed with Chebyshev tapering to improve the side-lobe levels. Also, via holes are arranged adaptively for each power line to further suppress surface currents; which are typical to stripline-microstrip design transitions. The designed antenna was used for initial 5G base-station tests and channel modelling. This proved also that a low profile antenna can be designed for the tentative IMT 2020 5G standard in the mm-Wave.
Perspectives
A strong case for the mm-Wave frequency band to be used for the next generation communication has been presented. Most mm-Wave 5G researches have been focused on channel optimizations to ascertain the viability of the band for cellular communication. With little research into the feasibility of low profile base station antennas, we set out to design a suitable microstrip antenna prototype with specified parameters obtained from already existing research. I hope many antenna and communication engineers will find this publication very resourceful. The design techniques outlined can also be of great help for antenna designers.
Mr Philip Ayiku Dzagbletey
Seoul National University of Science and Technology
Read the Original
This page is a summary of: Stacked Microstrip Linear Array for Millimeter-Wave 5G Baseband Communication, IEEE Antennas and Wireless Propagation Letters, January 2018, Institute of Electrical & Electronics Engineers (IEEE),
DOI: 10.1109/lawp.2018.2816258.
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