Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies

  • Nauman H. Khan, Syed M. Alam, Soha Hassoun
  • IEEE Transactions on Very Large Scale Integration (VLSI) Systems, April 2011, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/tvlsi.2009.2038165

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http://dx.doi.org/10.1109/tvlsi.2009.2038165