Impact of CMP Consumables on Copper Metallization Reliability

• Y.S. Obeng, J.E. Ramsdell, S. Deshpande, S.C. Kuiry, K. Chamma, K.A. Richardson, S. Seal

• IEEE Transactions on Semiconductor Manufacturing, November 2005, Institute of Electrical & Electronics Engineers (IEEE)
• DOI: 10.1109/tsm.2005.858457