Impact of CMP Consumables on Copper Metallization Reliability

  • Y.S. Obeng, J.E. Ramsdell, S. Deshpande, S.C. Kuiry, K. Chamma, K.A. Richardson, S. Seal
  • IEEE Transactions on Semiconductor Manufacturing, November 2005, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/tsm.2005.858457

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http://dx.doi.org/10.1109/tsm.2005.858457