Development of epoxy-aluminum nanocomposite dielectric material with low filler concentration for embedded capacitor applications

  • Siny Paul, T. K. Sindhu
  • IEEE Transactions on Dielectrics and Electrical Insulation, April 2014, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/tdei.2013.004175

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http://dx.doi.org/10.1109/tdei.2013.004175

The following have contributed to this page: Dr SINDHU T KRISHNAN