Visualization of Fluid/Structure Interaction in IC Encapsulation

  • Chu Yee Khor, Mohd Zulkifly Abdullah, Wei Chiat Leong
  • IEEE Transactions on Components Packaging and Manufacturing Technology, August 2012, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/tcpmt.2012.2199117

The authors haven't yet claimed this publication.

Read Publication

http://dx.doi.org/10.1109/tcpmt.2012.2199117