The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application

  • Chia-Yeh Yang, Yu-Ting Cheng, Wen-Syang Hsu
  • IEEE Transactions on Advanced Packaging, May 2010, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/tadvp.2009.2038235

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http://dx.doi.org/10.1109/tadvp.2009.2038235