Solder joints properties assessment in the terms of 4P Soldering Model

Ioan Plotog, Traian Cucu, Bogdan Mihailescu, Paul Svasta, Mihai Branzei, Mihai Tarcolea, Florin Miculescu, Andreas Thumm, Andreas Flechtmann
  • October 2011, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/siitme.2011.6102710
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The following have contributed to this page: Professor Mihai Tarcolea