Strength and Processing Properties using a Photopolymer Resin in a Powder-based 3DP Process

Won-hee Lee, Dong-soo Kim, Jung-soo Kim, Taek-min Lee, Dong-yoon Shin, Min-cheol Lee
  • January 2006, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/sice.2006.314929

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http://dx.doi.org/10.1109/sice.2006.314929