Thermal ALD of Cu via reduction of CuxO films for the advanced metallization in spintronic and ULSI interconnect systems

Steve Mueller, Thomas Waechtler, Lutz Hofmann, Andre Tuchscherer, Robert Mothes, Ovidiu Gordan, Daniel Lehmann, Francisc Haidu, Marcel Ogiewa, Lukas Gerlich, Shao-Feng Ding, Stefan E. Schulz, Thomas Gessner, Heinrich Lang, Dietrich R.T. Zahn, Xin-Ping Qu
  • September 2011, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/scd.2011.6068736

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http://dx.doi.org/10.1109/scd.2011.6068736

The following have contributed to this page: Professor Dietrich RT Zahn