Vacuum Wafer Level Packaged Two-Dimensional Optical Scanner by Anodic Bonding

  • H. Tachibana, K. Kawano, H. Ueda, H. Noge
  • January 2009, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/memsys.2009.4805544

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http://dx.doi.org/10.1109/memsys.2009.4805544

The following have contributed to this page: Professor Hiroshi Noge