Modelling and testing the impact of hot solder dip process on leaded components

  • Stoyan Stoyanov, Chris Best, M. O. Alam, Chris Bailey, Peter Tollafield, Mike Parker, Jim Scott
  • May 2012, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/isse.2012.6273091

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http://dx.doi.org/10.1109/isse.2012.6273091