Mitigating TSV-induced substrate noise in 3-D ICs using GND plugs

  • Nauman H. Khan, Syed M. Alam, Soha Hassoun
  • March 2011, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/isqed.2011.5770813

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http://dx.doi.org/10.1109/isqed.2011.5770813