Ultra-Soft and High Magnetic Moment NiFe Films Prepared via Electrodeposition from A Cu2+ Contained Solution

B. Zong, G. Han, Y. Zheng, K. Li, Z. Guo, J. Qiu, L. Wang, Z. Liu, L. An, P. Luo, H. Li, B. Liu
  • May 2006, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/intmag.2006.375548

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http://dx.doi.org/10.1109/intmag.2006.375548

The following have contributed to this page: Dr BaoYu Zong