Mechanical and electrical properties of mica/epoxy composite materials

  • Hee Dong Kim, Hee Gon Kim, Jong Jeong Park, Tae Wan Kim, Jeong Hoon Kim
  • Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/icpadm.1997.616609

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http://dx.doi.org/10.1109/icpadm.1997.616609