Targeted cooling with CVD diamond and micro-channel to meet 3-D IC heat dissipation challenge

  • Aftab Alam Khan, Shabaz Basheer Patel, Divanshu Chaturvedi, Ashudeb Dutta, Shivgovind Singh
  • December 2012, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/icemelec.2012.6636254

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http://dx.doi.org/10.1109/icemelec.2012.6636254