Influence of the microstructure on the stress state of solder joints during thermal cycling

Alexander Menk, Stephane Bordas
  • April 2009, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/esime.2009.4938405
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The following have contributed to this page: Professor Stéphane P.A. BORDAS and Professor Stephane Pierre Alain Bordas