MoldFlow simulation study on void risk prediction for FCCSP with molded underfill technology

Freedman Yen, Leo Hung, Nicholas Kao, Don Son Jiang
  • December 2014, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/eptc.2014.7028307

The authors haven't yet claimed this publication.

Read Publication

http://dx.doi.org/10.1109/eptc.2014.7028307