Thermal cycling reliability assessment and enhancement of embedded wafer level LGA packages for power applications

  • Yiyi Ma, Kim-Yong Goh, Xueren Zhang, Yonggang Jin
  • December 2013, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/eptc.2013.6745792

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http://dx.doi.org/10.1109/eptc.2013.6745792